The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 29, 2019

Filed:

Feb. 10, 2017
Applicant:

Renesas Electronics Corporation, Koutou-ku, Tokyo, JP;

Inventor:

Tamotsu Ogata, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/11568 (2017.01); H01L 29/51 (2006.01); H01L 29/792 (2006.01); H01L 29/423 (2006.01); H01L 21/28 (2006.01); H01L 21/02 (2006.01); H01L 21/311 (2006.01); H01L 29/66 (2006.01); G11C 16/04 (2006.01); G11C 16/10 (2006.01); G11C 16/14 (2006.01); H01L 29/08 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11568 (2013.01); G11C 16/0433 (2013.01); G11C 16/0466 (2013.01); G11C 16/10 (2013.01); G11C 16/14 (2013.01); H01L 21/0214 (2013.01); H01L 21/0217 (2013.01); H01L 21/02164 (2013.01); H01L 21/28282 (2013.01); H01L 21/31111 (2013.01); H01L 29/0847 (2013.01); H01L 29/42344 (2013.01); H01L 29/513 (2013.01); H01L 29/518 (2013.01); H01L 29/66833 (2013.01); H01L 29/792 (2013.01);
Abstract

An improvement is achieved in the performance of a semiconductor device having a nonvolatile memory. A memory cell of the nonvolatile memory includes a control gate electrode formed over a semiconductor substrate via a first insulating film and a memory gate electrode formed over the semiconductor substrate via a second insulating film to be adjacent to the control gate electrode via the second insulating film. The second insulating film includes a third insulating film made of a silicon dioxide film, a fourth insulating film made of a silicon nitride film over the third insulating film, and a fifth insulating film over the fourth insulating film. The fifth insulating film includes a silicon oxynitride film. Between the memory gate electrode and the semiconductor substrate, respective end portions of the fourth and fifth insulating films are located closer to a side surface of the memory gate electrode than an end portion of a lower surface of the memory gate electrode. Between the memory gate electrode and the semiconductor substrate, in a region where the second insulating film is not formed, another silicon dioxide film is embedded.


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