The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2019
Filed:
Dec. 10, 2014
Applicant:
Ams International Ag, Rapperswil-Jona, CH;
Inventors:
Assignee:
ams International AG, Rapperswil, CH;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); G01D 11/24 (2006.01);
U.S. Cl.
CPC ...
H01L 24/17 (2013.01); G01D 11/245 (2013.01); H01L 21/565 (2013.01); H01L 23/3107 (2013.01); H01L 23/3121 (2013.01); H01L 24/32 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/16113 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83851 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/12043 (2013.01); H01L 2924/14 (2013.01); H01L 2924/146 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/20643 (2013.01); H01L 2924/20644 (2013.01); H01L 2924/20645 (2013.01);
Abstract
A sensor package comprises a sensor chip bonded to an intermediate carrier, with the sensor element over an opening in the carrier. The package is for soldering to a board, during which the intermediate carrier protects the sensor part of the sensor chip.