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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10192836 B1

PDFFull Text
Expired
Date of Patent:
Jan. 29, 2019

Filed:

Mar. 30, 2015

Semiconductor device

Applicant:

Pezy Computing K.k., Tokyo, JP;

Inventor:

Motoaki Saito, Tokyo, JP;

Assignee:

PEZY COMPUTING K.K., Tokyo, JP;

Attorney:

Muncy, Geissler, Olds & Lowe, P.C.

Primary Examiner:

Moazzam Hossain

Assistant Examiner:

Stanetta Isaac

Int. Cl.
CPC ...
H01L 23/64 (2006.01); H01L 21/822 (2006.01); H01L 25/065 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 27/04 (2006.01); H04B 5/02 (2006.01); H01F 5/00 (2006.01); H01F 38/14 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 23/522 (2006.01); H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
H01L 23/645 (2013.01); H01F 5/003 (2013.01); H01F 38/14 (2013.01); H01L 21/822 (2013.01); H01L 23/49838 (2013.01); H01L 23/5227 (2013.01); H01L 23/5381 (2013.01); H01L 23/5385 (2013.01); H01L 24/16 (2013.01); H01L 25/065 (2013.01); H01L 25/0655 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H01L 27/04 (2013.01); H04B 5/02 (2013.01); H01L 23/147 (2013.01); H01L 23/49816 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15313 (2013.01);
Abstract

A semiconductor device equipped with a base board, a first element, a second element, and an interposer board, wherein: the first element is positioned on the base board; a signal transmitting/receiving terminal of the first element and a plurality of base board terminals contact one another; the second element is positioned on the base board; a signal transmitting/receiving terminal of the second element and the plurality of base board terminals contact one another; the interposer board is positioned so as to extend on the first element and the second element; a first contactless signal transmitting/receiving unit of the interposer board is capable of contactlessly transmitting and receiving a signal; and a second contactless signal transmitting/receiving unit of the interposer board is capable of contactlessly transmitting and receiving a signal.

Find Patent Forward Citations

Saito, Motoaki. (2019). Semiconductor device (U.S. Patent No. 10192836). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10192836

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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