The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 29, 2019

Filed:

Feb. 03, 2017
Applicant:

Toyota Motor Engineering & Manufacturing North America, Inc., Erlanger, KY (US);

Inventors:

Yuji Fukuoka, Northville, MI (US);

Ercan Dede, Ann Arbor, MI (US);

Kyosuke Miyagi, Ann Arbor, MI (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/473 (2006.01); H01L 23/498 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 23/3677 (2013.01); H01L 23/4735 (2013.01);
Abstract

An electronics assembly includes a cooling chip structure having a device facing surface opposite a base surface and one or more sidewalls extending around a perimeter of the cooling chip structure between the device facing surface and the base surface. A plurality of fluid microchannels fluidly are coupled to a fluid inlet port and a fluid outlet port. A through substrate via extends from the base surface of the cooling chip structure to the device facing surface of the cooling chip structure, where the through substrate via intersects two or more fluid microchannels of the plurality of fluid microchannels.


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