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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10192806 B1

PDFFull Text
Date of Patent:
Jan. 29, 2019

Filed:

Jun. 13, 2016

Semiconductor device

Applicant:

Fuji Electric Co., Ltd., Kawasaki-shi, JP;

Inventors:

Takahiro Nishijima, Matsumoto, JP;

Takashi Katsuki, Matsumoto, JP;

Toshio Denta, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki-Shi, JP;

Attorney:

Manabu Kanesaka

Primary Examiner:

Tuan Nguyen

Int. Cl.
CPC ...
G01P 3/14 (2006.01); H01L 21/50 (2006.01); H01L 23/48 (2006.01); H01L 23/29 (2006.01); H01L 23/373 (2006.01); H01L 23/057 (2006.01); H01L 23/24 (2006.01); H01L 23/31 (2006.01); H01L 23/12 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); H01L 23/057 (2013.01); H01L 23/24 (2013.01); H01L 23/3142 (2013.01); H01L 23/12 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19107 (2013.01);
Abstract

A semiconductor device includes an insulating substrate having a metal plate, an insulating resin plate, and a circuit plate laminated in order; a semiconductor element fixed to the circuit plate; a wiring member connected to an electrode disposed on a front surface of the semiconductor element or to the circuit plate of the insulating substrate; a housing accommodating the insulating substrate, the semiconductor element, and the wiring member; and a sealing material including a thermosetting resin, and sealing the insulating substrate, the semiconductor element, and the wiring member accommodated in the housing. The circuit plate of the insulating substrate is selectively formed on the insulating resin plate as a combination of a circuit pattern with a sealing material adhering pattern.

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