The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 29, 2019

Filed:

Apr. 21, 2015
Applicant:

Sumco Corporation, Tokyo, JP;

Inventors:

Jun Fujise, Tokyo, JP;

Toshiaki Ono, Tokyo, JP;

Assignee:

SUMCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/322 (2006.01); H01L 29/32 (2006.01); C30B 15/20 (2006.01); C30B 33/02 (2006.01); C30B 15/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3221 (2013.01); H01L 21/3225 (2013.01); H01L 29/32 (2013.01); C30B 15/00 (2013.01); C30B 15/203 (2013.01); C30B 33/02 (2013.01); H01L 21/322 (2013.01);
Abstract

A method for producing an epitaxial silicon wafer, including a preliminary thermal treatment step of subjecting a silicon wafer to thermal treatment for increasing a density of oxygen precipitates, the silicon wafer being one that has an oxygen concentration in a range of 9×10atoms/cmto 16×10atoms/cm, contains no dislocation cluster and no COP, and contains an oxygen precipitation suppression region, and an epitaxial layer forming step of forming an epitaxial layer on a surface of the silicon wafer after the preliminary thermal treatment step. The production method further includes a thermal treatment condition determining step of determining a thermal treatment condition in the preliminary thermal treatment step, based on a ratio of the oxygen precipitation suppression region of the silicon wafer before the preliminary thermal treatment step is carried out.


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