The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 29, 2019

Filed:

Oct. 28, 2014
Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Yosuke Matsushita, Kyoto, JP;

Takao Okano, Kyoto, JP;

Hiroyuki Sasaki, Kyoto, JP;

Kenichiro Kikuchi, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/28 (2006.01); H01F 17/00 (2006.01); H01F 27/29 (2006.01); H01G 4/30 (2006.01); H01G 4/232 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 17/0013 (2013.01); H01F 27/292 (2013.01); H01F 2027/2809 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01);
Abstract

A multilayer bodyis obtained by stacking a plurality of insulator layers in which an inner conductor and a via hole conductor are formed. Outer electrodesthroughconnected to the inner conductor layers are formed on the opposite side surfaces of the multilayer bodyWhile the two outer electrodesandare formed so as to extend from one principal surface to the other principal surface of the multilayer bodythe other outer electrodesthroughare formed so as to extend from one principal surface to an exposed portion of the inner conductor on the multilayer bodyor formed so as not to reach the other principal surface. In addition, the widths of the outer electrodesthroughmay differ from one another.


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