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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10192650 B1

PDFFull Text
Date of Patent:
Jan. 29, 2019

Filed:

May. 02, 2017

Photosensitive conductive paste, method of producing multilayer electronic component using the same, and multilayer electronic component

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Kenta Kondo, Nagaokakyo, JP;

Tomonori Sakata, Nagaokakyo, JP;

Masahiro Kubota, Nagaokakyo, JP;

Machiko Motoya, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;

Attorney:

Arent Fox LLP

Primary Examiner:

Mark Kopec

Int. Cl.
CPC ...
H01B 1/22 (2006.01); B05D 5/12 (2006.01); C03C 3/00 (2006.01); C03C 8/18 (2006.01); C09D 5/24 (2006.01); G03F 7/004 (2006.01); G03F 7/038 (2006.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01); C03C 3/076 (2006.01); C03C 3/089 (2006.01); C03C 3/091 (2006.01); C03C 8/02 (2006.01); C03C 8/04 (2006.01); G03F 7/029 (2006.01); G03F 7/031 (2006.01); G03F 7/033 (2006.01); H05K 3/02 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H01B 1/22 (2013.01); B05D 5/12 (2013.01); C03C 3/076 (2013.01); C03C 3/089 (2013.01); C03C 3/091 (2013.01); C03C 8/02 (2013.01); C03C 8/04 (2013.01); C03C 8/18 (2013.01); C09D 5/24 (2013.01); G03F 7/0047 (2013.01); G03F 7/029 (2013.01); G03F 7/031 (2013.01); G03F 7/033 (2013.01); G03F 7/038 (2013.01); H05K 1/028 (2013.01); H05K 1/095 (2013.01); H05K 3/02 (2013.01); H05K 3/4629 (2013.01); H05K 2203/0514 (2013.01);
Abstract

A photosensitive conductive paste that contains (a) a conductive powder in an amount of 70.3 to 85.6 mass % with respect to the total amount of the photosensitive conductive paste; (b) a photosensitive resin composition containing an alkali-soluble polymer, a photosensitive monomer, a photopolymerization initiator, and a solvent; and (c) a glass frit. The mass ratio of the glass frit to the conductive powder is 0.020 to 0.054, and the glass frit has a softening point that is equal to or above the temperature at which sintering of the conductive powder starts.

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