The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 29, 2019

Filed:

Aug. 14, 2016
Applicants:

Sony Corporation, Tokyo, JP;

Sony Corporation of America, New York, NY (US);

Inventors:

Nobuo Tanaka, Glen Rock, NJ (US);

Vladimir Elgort, Staten Island, NY (US);

Jacelyn Danielson, San Mateo, CA (US);

Anton Kalachev, Burlingame, CA (US);

John Wong, Morristown, NJ (US);

Behram DaCosta, San Jose, CA (US);

Udupi Ramanath Bhat, Mountain View, CA (US);

Ludovic Copere, San Jose, CA (US);

Masaki Kataoka, Port Washington, NY (US);

Assignees:

SONY CORPORATION, Tokyo, JP;

SONY CORPORATION OF AMERICA, New York, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/01 (2006.01); G06F 1/16 (2006.01); G06F 19/00 (2018.01); H04L 29/06 (2006.01); H04W 12/06 (2009.01); G16H 40/63 (2018.01); G08B 7/00 (2006.01);
U.S. Cl.
CPC ...
G06F 3/011 (2013.01); G06F 1/163 (2013.01); G06F 1/1637 (2013.01); G06F 1/1698 (2013.01); G06F 1/325 (2013.01); G06F 1/3206 (2013.01); G06F 1/3287 (2013.01); G06F 3/015 (2013.01); G06F 3/016 (2013.01); G06F 19/00 (2013.01); G06F 19/3418 (2013.01); G16H 40/63 (2018.01); H04L 63/0861 (2013.01); H04L 63/0869 (2013.01); H04W 12/06 (2013.01); G06F 1/1626 (2013.01); G08B 7/00 (2013.01); Y02D 10/171 (2018.01);
Abstract

A method and apparatus for providing customized haptic feedback for a wearable device with sensors, a processor, memory, haptic outputs and optional communications module. Sensor information is used to provide the context for customizing the haptic feedback.


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