The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 29, 2019

Filed:

Feb. 23, 2016
Applicant:

Sii Semiconductor Corporation, Chiba-shi, Chiba, JP;

Inventor:

Toshiro Futatsugi, Chiba, JP;

Assignee:

ABLIC INC., , JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 27/22 (2006.01);
U.S. Cl.
CPC ...
G01N 27/223 (2013.01);
Abstract

A humidity sensor includes an insulating film formed on a semiconductor substrate, and a plurality of first electrodes and a plurality of second electrodes arranged on the insulating film so that each first electrode is adjacent to four of the second electrodes in four directions of up, down, right, and left when viewed in plan view, while each second electrode is adjacent to four of the first electrodes in four directions of up, down, right, and left when viewed in plan view. Metal wiring embedded in the insulating film electrically connects one of the first electrodes to another of the first electrodes, and electrically connects one of the second electrodes to another of the second electrodes. The humidity sensor has increased capacitance per unit area and improved adhesiveness and can be made using normal semiconductor manufacturing processes.


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