The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 29, 2019

Filed:

Sep. 25, 2014
Applicant:

Murata Manufacturing Co., Ltd, Nagaokakyo-shi, Kyoto, JP;

Inventors:

Kazuhiro Tanimoto, Nagoya, JP;

Mitsunobu Yoshida, Ichihara, JP;

Shigeo Nishikawa, Chiba, JP;

Masamichi Ando, Nagaokakyo, JP;

Hidekazu Kano, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01L 1/16 (2006.01); H01L 41/193 (2006.01); G06F 3/041 (2006.01); H01L 41/113 (2006.01); H01L 41/45 (2013.01);
U.S. Cl.
CPC ...
G01L 1/16 (2013.01); G06F 3/0414 (2013.01); H01L 41/1132 (2013.01); H01L 41/193 (2013.01); G06F 2203/04105 (2013.01); H01L 41/45 (2013.01);
Abstract

A pressure-sensing device including a pressed component that has a contact surface to which pressure is applied by contact from a presser; a polymeric piezoelectric element that is disposed at an opposite side from the contact surface of the pressed component and that has a piezoelectric constant dof 1 pC/N or more as measured at 25° C. using a stress-charge method; a curable resin layer that includes at least one selected from the group consisting of cold-setting resins, thermosetting resins, and actinic radiation-curable resins and that is in contact with at least part of a surface of the polymeric piezoelectric element; and an electrode that is in contact with at least part of a surface of the polymeric piezoelectric element or of a surface of the curable resin layer.


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