The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 29, 2019

Filed:

May. 18, 2018
Applicant:

Heptagon Micro Optics Pte. Ltd., Singapore, SG;

Inventors:

Qichuan Yu, Singapore, SG;

Hartmut Rudmann, Jona, CH;

Ji Wang, Singapore, SG;

Kian Siang Ng, Singapore, SG;

Simon Gubser, Weesen, CH;

Sonja Hanselmann, Lachen, CH;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/02 (2006.01); G01J 1/02 (2006.01); H01L 31/173 (2006.01);
U.S. Cl.
CPC ...
G01J 1/0295 (2013.01); G01J 1/0209 (2013.01); G01J 1/0214 (2013.01); G01J 1/0271 (2013.01); H01L 31/173 (2013.01);
Abstract

Disclosed are optical devices and methods of manufacturing optical devices. An optical device can include a substrate; an optical emitter chip affixed to the front surface of the substrate; and an optical sensor chip affixed to the front surface of the substrate. The optical sensor chip can include a main sensor and a reference sensor. The optical device can include an opaque dam separating the main optical sensor and the reference sensor. The optical device can include a first transparent encapsulation block encapsulating the optical emitter chip and the reference optical sensor and a second transparent encapsulation block encapsulating the main optical sensor. The optical device can include an opaque encapsulation material encapsulating the first transparent encapsulation block and the second transparent encapsulation block with a first opening above the main optical sensor and a second opening above the optical emitter chip.


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