The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2019
Filed:
Mar. 13, 2015
Applicant:
Siemens Aktiengesellschaft, München, DE;
Inventors:
Bahadir Basdere, Berlin, DE;
Diana Felkel, Berlin, DE;
Andrea Massa, Berlin, DE;
Rolf Wilkenhöner, Kleinmachnow, DE;
Adrian Wollnik, Dallgow-Döberitz, DE;
Assignee:
SIEMENS AKTIENGESELLSCHAFT, , DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F01D 5/00 (2006.01); F01D 5/18 (2006.01); F01D 5/28 (2006.01); B23K 26/382 (2014.01); B23K 26/40 (2014.01); B23K 26/0622 (2014.01); B23K 26/384 (2014.01); B23K 101/00 (2006.01); B23K 101/34 (2006.01); B23K 103/16 (2006.01); B23K 103/18 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
F01D 5/184 (2013.01); B23K 26/0622 (2015.10); B23K 26/384 (2015.10); B23K 26/389 (2015.10); B23K 26/40 (2013.01); F01D 5/005 (2013.01); F01D 5/288 (2013.01); B23K 2101/001 (2018.08); B23K 2101/34 (2018.08); B23K 2103/172 (2018.08); B23K 2103/26 (2018.08); B23K 2103/52 (2018.08); B23P 2700/06 (2013.01); F01D 5/186 (2013.01); F05D 2230/13 (2013.01); F05D 2260/202 (2013.01); Y10T 29/49337 (2015.01);
Abstract
Introducing a through hole into a substrate () before coating, and performing the removal thereafter, shortens the machining times for producing a through hole () with a diffuser () and also subjects the intermediate layers to less stress.