The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 29, 2019

Filed:

Jun. 06, 2016
Applicants:

Jiali Wu, Yorktown Heights, NY (US);

Kellsie Shan, Carmel, NY (US);

Lei Shan, Carmel, NY (US);

Inventors:

Jiali Wu, Yorktown Heights, NY (US);

Kellsie Shan, Carmel, NY (US);

Lei Shan, Carmel, NY (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 5/14 (2006.01); C08L 83/04 (2006.01); H05K 7/20 (2006.01); C08K 3/04 (2006.01); C08K 3/20 (2006.01); C08K 3/22 (2006.01); C08K 3/08 (2006.01); C08K 5/5415 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); C08K 3/04 (2013.01); C08K 3/20 (2013.01); C08L 83/04 (2013.01); H05K 7/2039 (2013.01); C08K 5/5415 (2013.01); C08K 2003/0812 (2013.01); C08K 2003/2227 (2013.01); C08K 2201/005 (2013.01);
Abstract

A thermally conductive interface composition is interposed between a heat generating component and a heat dissipating component. To meet escalated heat dissipation for performance demanding devices, a thermally conductive interface composition comprises (A) A linear alkenyl organopolysiloxane containing a silicon-bonded alkenyl-terminated group or groups, (B) A branched alkenyl organopolysiloxane containing at least two silicon-bonded alkenyl groups, (C) thermally conductive fillers in a ternary particle size mixture, (D) An organohydrogenpolysiloxane containing at least two Si—H terminated groups, (E) An addition reaction catalyst, (F) A hydroxy group-containing siloxane, (G) Alkoxy group-containing siloxanes.


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