The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10190027 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 29, 2019

Filed:

Aug. 21, 2018
Applicant:

Henkel Ag & Co. Kgaa, Duesseldorf, DE;

Inventor:

Ai Takamori, Osaka, JP;

Assignee:

HENKEL AG & CO. KGAA, Duesseldorf, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 129/14 (2006.01); C09J 7/35 (2018.01); C09J 7/21 (2018.01); B31F 5/04 (2006.01); B32B 27/10 (2006.01); B32B 27/32 (2006.01); B32B 29/08 (2006.01); C08L 23/02 (2006.01); C08L 23/08 (2006.01); C08L 53/02 (2006.01); C08L 93/04 (2006.01); C08L 91/06 (2006.01); C09J 191/06 (2006.01);
U.S. Cl.
CPC ...
C09J 129/14 (2013.01); B31F 5/04 (2013.01); B32B 27/10 (2013.01); B32B 27/32 (2013.01); B32B 29/08 (2013.01); C08L 23/02 (2013.01); C08L 23/0815 (2013.01); C08L 23/0869 (2013.01); C08L 53/025 (2013.01); C08L 93/04 (2013.01); C09J 7/21 (2018.01); C09J 7/35 (2018.01); B32B 2255/12 (2013.01); B32B 2307/306 (2013.01); B32B 2405/00 (2013.01); C08L 91/06 (2013.01); C08L 2205/035 (2013.01); C09J 191/06 (2013.01); C09J 2400/283 (2013.01); C09J 2409/00 (2013.01); C09J 2423/00 (2013.01); C09J 2423/04 (2013.01); C09J 2423/10 (2013.01); C09J 2431/00 (2013.01); C09J 2433/00 (2013.01); C09J 2491/00 (2013.01);
Abstract

The object of the present invention is to provide a hot melt adhesive which is less likely to cause stringing and has excellent thermal stability, and further has excellent adhesion, in particular adhesion to a paper substrate. The present invention relates to a hot melt adhesive comprising: (A) a polar functional group-modified polymer, (B) a butyral resin, (C) an olefin-based polymer, and (D) a tackifier resin.


Find Patent Forward Citations

Takamori, Ai. (2019). Hot melt adhesive (U.S. Patent No. 10190027). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10190027

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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