The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2019
Filed:
Jan. 09, 2015
Dow Global Technologies Llc, Midland, MI (US);
Roland Bayer, Walsrode, DE;
Anette Wagner, Walsrode, DE;
DOW GLOBAL TECHNOLOGIES LLC, Midland, MI (US);
Abstract
A heat moldable composition which useful for preparing ceramic bodies comprises an inorganic material that sets as a result of baking or sintering, and a hydroxypropyl methylcellulose having a DS of at least 1.4 and an MS of at least 0.6, wherein DS is the degree of substitution of methoxyl groups and MS is the molar substitution of hydroxypropoxyl groups, and a viscosity of up to 80 mPa·s, determined as a 2% by weight solution in water at 20° C., wherein the heat moldable composition comprises at least 40 weight percent of the inorganic material and at least 10 weight percent of the hydroxypropyl methylcellulose, and wherein the composition does not comprise more than 5 weight percent of water, all percentages being based on the total weight of the composition.