The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2019
Filed:
Aug. 25, 2017
Applicant:
Dunan Microstaq, Inc., Austin, TX (US);
Inventors:
Wayne C. Long, Austin, TX (US);
Joe A. Ojeda, Austin, TX (US);
Gengxun K. Gurley, Hutto, TX (US);
Joseph L. Nguyen, Austin, TX (US);
Assignee:
DunAn Microstaq, Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); B81C 1/00 (2006.01); B23K 1/00 (2006.01); B23K 35/02 (2006.01); B81C 3/00 (2006.01); B23K 101/36 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00301 (2013.01); B23K 1/0016 (2013.01); B23K 35/0222 (2013.01); B81C 3/005 (2013.01); B23K 2101/36 (2018.08); B81C 2203/035 (2013.01); B81C 2203/055 (2013.01);
Abstract
A method of attaching a MEMS die to a surface includes centering and rotationally aligning a solder perform on a solder surface of a body, centering and rotationally aligning a MEMS die on the solder preform, and heating the solder perform in a reflow process until the solder is molten and surface tension of the molten solder moves the MEMS die to a position where the surface tensions balance, and the MEMS die is centered on, and rotationally aligned with, the solder surface of the body.