The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2019
Filed:
Mar. 27, 2015
Dai Nippon Printing Co., Ltd., Tokyo, JP;
Makoto Aoyagi, Tokyo, JP;
Taku Nishikawa, Tokyo, JP;
Daisuke Fukui, Tokyo, JP;
Munenori Ieshige, Tokyo, JP;
Dai Nippon Printing Co., Ltd., Shinjuku-Ku, JP;
Abstract
Provided is a method for producing a support for a thermal transfer image-receiving sheet, including laminating a substrate and a porous film by a melt-extruded resin while passing the substrate and the porous film through a portion between rollers in a pair, wherein a thermal transfer image-receiving sheet excellent in adhesiveness between the substrate and the porous film and excellent in the texture of a print surface can be obtained. A method for producing a support for a thermal transfer image-receiving sheet according to the present invention is a method for producing a support for a thermal transfer image-receiving sheet including a substrate layer composed of a substrate, an adhesive layer composed of a melt-extruded resin, and a porous layer including a porous film that are layered in the order mentioned, in which the substrate and the porous film are laminated by the melt-extruded resin while passing the substrate and the porous film through the portion between rollers in a pair having a spacing with a distance d; and a difference (d−h) between the distance d which is the spacing between the rollers in the pair and the total thickness h of the substrate layer, the adhesive layer, and the porous layer is −50 μm or more and 50 μm or less.