The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2019
Filed:
Sep. 22, 2016
Applicant:
The Boeing Company, Chicago, IL (US);
Inventors:
Patrice K. Ackerman, Kent, WA (US);
Weston K. Anderson, Federal Way, WA (US);
Russell J. Heeter, Sammamish, WA (US);
Assignee:
THE BOEING COMPANY, Chicago, IL (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 37/12 (2006.01); B32B 37/18 (2006.01); B32B 37/00 (2006.01); B32B 38/00 (2006.01); B29C 73/10 (2006.01); B64D 45/02 (2006.01); B64F 5/40 (2017.01); B29C 65/56 (2006.01); B32B 3/30 (2006.01); B32B 15/09 (2006.01); B64C 1/12 (2006.01); B29L 31/30 (2006.01);
U.S. Cl.
CPC ...
B32B 37/182 (2013.01); B29C 65/562 (2013.01); B29C 73/10 (2013.01); B32B 3/30 (2013.01); B32B 15/09 (2013.01); B32B 37/0046 (2013.01); B32B 37/12 (2013.01); B32B 37/18 (2013.01); B32B 38/0012 (2013.01); B64C 1/12 (2013.01); B64D 45/02 (2013.01); B64F 5/40 (2017.01); B29L 2031/3076 (2013.01); B32B 2037/1246 (2013.01); B32B 2038/0016 (2013.01); B32B 2305/22 (2013.01); B32B 2307/202 (2013.01); B32B 2307/204 (2013.01); B32B 2313/04 (2013.01); B32B 2331/00 (2013.01); B32B 2605/18 (2013.01);
Abstract
A repair apparatus for an electrically conductive layer of a composite structure includes a dielectric layer, having a perimeter, secured to the composite structure, a first adhesive layer, and a conductive layer, secured over the dielectric layer and to the composite structure via the first adhesive layer around an entirety of the perimeter of the dielectric layer, the first adhesive layer being scored along a perimeter region thereof to improve a conductive path between the conductive layer and the composite structure.