The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 29, 2019

Filed:

Apr. 14, 2015
Applicant:

Koito Manufacturing Co., Ltd., Tokyo, JP;

Inventors:

Masato Nakamura, Shizuoka, JP;

Takahiro Kohata, Shizuoka, JP;

Toshimasa Ikeda, Shizuoka, JP;

Assignee:

KOITO MANUFACTURING CO., LTD., Minato-ku, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/40 (2006.01); B60Q 1/04 (2006.01); B29C 45/37 (2006.01); F21S 41/50 (2018.01); B29K 101/12 (2006.01);
U.S. Cl.
CPC ...
B29C 45/37 (2013.01); F21S 41/50 (2018.01); B29K 2101/12 (2013.01); B29K 2995/0041 (2013.01); B29K 2995/0072 (2013.01);
Abstract

A resin molded piece is made from a crystalline resin and is molded by filling a molding spacewhich is defined between a movable moldand a fixed moldwith the resin. The resin molded piece has a designed surfaceon to which a surface of the movable moldis transferred and a non-designed surfaceon to which a surface of the fixed moldis transferred. The designed surfaceincludes a mirror surface portion. Center line average roughnesses Ra of the mirror surface portionand the non-designed surfaceare both 0.5 μm or smaller. According to the resin molded piece and a fabrication method therefor, the surface roughness of the designed surface can be reduced while restricting a reduction in productivity.


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