The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2019
Filed:
Sep. 08, 2014
Applicant:
The Boeing Company, Huntington Beach, CA (US);
Inventors:
Karl M Nelson, Chicago, IL (US);
Malcolm Lane, Chicago, IL (US);
Anoshiravan Poursartip, Chicago, IL (US);
Kurtis S Willden, Chicago, IL (US);
Assignee:
THE BOEING COMPANY, Chicago, IL (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 43/00 (2006.01); B29C 43/58 (2006.01); B29C 43/36 (2006.01); B29C 70/44 (2006.01); B29C 70/54 (2006.01); B29K 105/08 (2006.01);
U.S. Cl.
CPC ...
B29C 43/58 (2013.01); B29C 43/3642 (2013.01); B29C 70/44 (2013.01); B29C 70/443 (2013.01); B29C 70/54 (2013.01); B29C 2043/3644 (2013.01); B29C 2043/3647 (2013.01); B29C 2043/5808 (2013.01); B29K 2105/0854 (2013.01); B29K 2105/0872 (2013.01);
Abstract
A system is provided for collecting data during vacuum molding of a composite part using a mold including an air tight, flexible membrane sealed to a tool. The system comprises a plurality of MEMS sensors coupled with the interior of the mold at different locations over the part. Each of the sensors produces signals related to a process parameter, such as pressure within the bag, that is sensed at the location of the sensor.