The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 29, 2019

Filed:

May. 10, 2017
Applicant:

Olympus Corporation, Tokyo, JP;

Inventors:

Noriyuki Fujimori, Suwa, JP;

Kazuaki Kojima, Suwa, JP;

Assignee:

OLYMPUS CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); A61B 1/00 (2006.01); A61B 1/05 (2006.01); G02B 7/02 (2006.01); G02B 13/00 (2006.01); G02B 23/24 (2006.01); H04N 5/225 (2006.01); B32B 37/14 (2006.01); B32B 38/10 (2006.01); H04N 5/335 (2011.01);
U.S. Cl.
CPC ...
A61B 1/0011 (2013.01); A61B 1/00096 (2013.01); A61B 1/00163 (2013.01); A61B 1/051 (2013.01); B32B 37/14 (2013.01); B32B 38/10 (2013.01); G02B 7/02 (2013.01); G02B 13/006 (2013.01); G02B 13/007 (2013.01); G02B 13/0035 (2013.01); G02B 13/0065 (2013.01); G02B 13/0085 (2013.01); G02B 23/243 (2013.01); H01L 27/14643 (2013.01); H01L 27/14687 (2013.01); H04N 5/2254 (2013.01); H04N 5/335 (2013.01); Y10T 156/1052 (2015.01);
Abstract

A manufacturing method for an image pickup unit, the method including: a step of bonding plural lens wafers, on which optical components are formed, and forming a lens unit wafer including plural lens units; a step of bonding a bending optical element wafer including plural bending optical elements to a first surface of the lens unit wafer such that the plural bending optical elements are respectively opposed to the plural lens units and forming an optical unit wafer; a step of separating and individualizing the optical unit wafer for each of the lens units and the bending optical elements and manufacturing plural optical units; and a step of respectively bonding solid-state image pickup devices to emission surfaces of lights of the bending optical elements of the optical units.


Find Patent Forward Citations

Fujimori, Noriyuki. (2019). Manufacturing method for image pickup unit and image pickup unit (U.S. Patent No. 10188269). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10188269

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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