The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 22, 2019

Filed:

Mar. 23, 2018
Applicant:

Hitachi Metals, Ltd., Tokyo, JP;

Inventors:

Junya Nishina, Yasugi, JP;

Keiichiro Maeda, Izumi, JP;

Ken Asada, Izumi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/06 (2006.01); F16J 15/08 (2006.01); F16J 15/06 (2006.01); B23K 35/30 (2006.01); C22C 5/08 (2006.01); H01L 23/10 (2006.01); B32B 15/01 (2006.01); C22C 38/10 (2006.01);
U.S. Cl.
CPC ...
H05K 5/066 (2013.01); B23K 35/30 (2013.01); B23K 35/302 (2013.01); B23K 35/3006 (2013.01); B23K 35/3053 (2013.01); B32B 15/013 (2013.01); B32B 15/018 (2013.01); C22C 5/08 (2013.01); C22C 38/105 (2013.01); F16J 15/064 (2013.01); F16J 15/0806 (2013.01); H01L 23/10 (2013.01); H01L 2924/0002 (2013.01); Y10T 29/49998 (2015.01);
Abstract

This seal ring () is made of a clad material in which a base material layer () and a brazing filler metal layer () arranged on a first surface () of the base material layer are bonded to each other, and a side brazing filler metal portion () of the brazing filler metal layer covering a side surface () of the base material layer is removed.


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