The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 22, 2019

Filed:

Jun. 29, 2015
Applicant:

Microsoft Technology Licensing, Llc, Redmond, WA (US);

Inventors:

Igor Markovsky, Redwood City, CA (US);

Michael Nikkhoo, Saratoga, CA (US);

Andriy Pletenetskyy, Mountain View, CA (US);

Erin Hurbi, San Francisco, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); G02B 27/01 (2006.01); G06F 3/01 (2006.01); G06T 19/00 (2011.01); H05K 3/00 (2006.01); H05K 3/30 (2006.01); H05K 3/46 (2006.01); H05K 5/00 (2006.01); H05K 3/06 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0284 (2013.01); G02B 27/0172 (2013.01); G06F 3/012 (2013.01); G06T 19/006 (2013.01); H05K 1/0271 (2013.01); H05K 3/0058 (2013.01); H05K 3/061 (2013.01); H05K 3/303 (2013.01); H05K 3/4688 (2013.01); H05K 5/0078 (2013.01); G02B 2027/0174 (2013.01); G02B 2027/0178 (2013.01); H05K 2201/068 (2013.01); H05K 2201/09081 (2013.01); H05K 2201/10969 (2013.01); H05K 2201/10984 (2013.01); H05K 2203/0228 (2013.01); H05K 2203/068 (2013.01);
Abstract

An adhesive joint system comprises a circuit board with a distal end and a proximal end mounted on a first side via a tongue and groove connection to a housing. An adhesive is positioned at least in the gap surrounding the tongue, and an electrical component mounted to the distal end on a second side of the circuit board that is opposite the first side. The respective coefficients of thermal expansion (CTE) of the tongue, adhesive, and the material defining the groove are related, such that as heat is applied to the tongue and groove connection, the adhesive is compressed within the gap.


Find Patent Forward Citations

Loading…