The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 22, 2019

Filed:

Apr. 25, 2018
Applicant:

Universal Lighting Technologies, Inc., Madison, AL (US);

Inventors:

Donald Folker, Madison, AL (US);

Wei Xiong, Madison, AL (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01); H01R 13/6594 (2011.01); H01R 13/6581 (2011.01); H01R 12/57 (2011.01); H05K 1/02 (2006.01); H01R 12/71 (2011.01); H01R 12/70 (2011.01); H01R 12/58 (2011.01);
U.S. Cl.
CPC ...
H01R 13/6594 (2013.01); H01R 12/57 (2013.01); H01R 12/58 (2013.01); H01R 12/7088 (2013.01); H01R 12/716 (2013.01); H01R 13/6581 (2013.01); H05K 1/0233 (2013.01);
Abstract

A connector assembly suppresses electromagnetic interference (EMI) generated by electronic circuitry on a printed circuit board (PCB). Certain embodiments of the connector assembly include common features such as conductive through-holes on the PCB, and a connector having terminal pins positionable through the conductive through-holes. The first embodiment includes a magnetic wafer positionable between the connector and the PCB. The second embodiment includes a plurality of stackable magnetic wafers positionable in a stack between the connector and the PCB. The third embodiment includes a magnetic cup wafer positionable between the connector and the PCB. The fourth embodiment, combines the cup wafer with the stackable magnetic wafers of the second and third embodiments. Each magnetic wafer includes wafer holes for the terminal pins to pass through. The magnetic wafers are configured to increase inductance and provide effective EMI noise suppression.


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