The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 22, 2019
Filed:
Jun. 13, 2018
Applicant:
Yazaki Corporation, Tokyo, JP;
Inventors:
Assignee:
YAZAKI CORPORATION, Minato-ku, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/03 (2006.01); H01R 4/60 (2006.01); H01B 1/02 (2006.01); H01B 7/00 (2006.01); H01R 4/18 (2006.01); C22C 5/06 (2006.01); B60R 16/02 (2006.01); H01R 4/62 (2006.01);
U.S. Cl.
CPC ...
H01R 13/03 (2013.01); C22C 5/06 (2013.01); H01B 1/02 (2013.01); H01B 7/0045 (2013.01); H01R 4/185 (2013.01); H01R 4/60 (2013.01); B60R 16/0207 (2013.01); H01R 4/62 (2013.01); H01R 2201/26 (2013.01);
Abstract
There is provided an electrical contact member including: a conductive base material; and an Ag—Sn alloy plated layer formed on the conductive base material, wherein the Ag—Sn alloy plated layer has a first Ag—Sn alloy plated layer having an Sn concentration of 5 to 38 at. % and a Vickers hardness of 100 or more Hv and less than 300 Hv and a second Ag—Sn alloy plated layer having a Vickers hardness higher than that of the first Ag—Sn alloy plated layer in this order from the outermost layer.