Semiconductor device and method of manufacturing the semiconductor device

Abstract

On a front surface of a semiconductor base, a first n-type drift region, a second n-type drift region, and a third n-type drift region are provided. In the front surface of the semiconductor base, a gate trench is provided penetrating the n-type source region and the p-type base region, and reaching the second n-type drift region. Between adjacent gate trenches, a contact trench is provided that penetrates the n-type source region, the p-type base region, and the second and third n-type drift regions, and that reaches the p-type semiconductor region. A source electrode embedded in the contact trench is in contact with the p-type semiconductor region at the bottom and the corners of the contact trench and forms a Schottky junction with the third n-type drift region and the second n-type drift region at a side wall of the contact trench.