The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 22, 2019
Filed:
Jun. 18, 2015
Heptagon Micro Optics Pte. Ltd., Singapore, SG;
Hartmut Rudmann, Jona, CH;
Simon Gubser, Weesen, CH;
Susanne Westenhöfer, Wettswil, CH;
Stephan Heimgartner, Aarau Rohr, CH;
Jens Geiger, Thalwil, CH;
Xu Yi, Singapore, SG;
Thng Chong Kim, Singapore, SG;
John A. Vidallon, Singapore, SG;
Ji Wang, Singapore, SG;
Qi Chuan Yu, Singapore, SG;
Kam Wah Leong, Singapore, SG;
Heptagon Micro Optics Pte. Ltd., Singapore, SG;
Abstract
Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.