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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10186527 B1

PDFFull Text
Date of Patent:
Jan. 22, 2019

Filed:

Apr. 15, 2016

Array substrate, method for manufacturing the array substrate, and display device

Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Xiangyong Kong, Beijing, CN;

Jun Cheng, Beijing, CN;

Xiaodi Liu, Beijing, CN;

Assignee:

BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;

Attorney:

Armstrong Teasdale LLP

Primary Examiner:

David S Blum

Int. Cl.
CPC ...
H01L 21/302 (2006.01); H01L 21/461 (2006.01); H01L 29/12 (2006.01); H01L 27/12 (2006.01); H01L 21/77 (2017.01); H01L 29/45 (2006.01); H01L 29/49 (2006.01); H01L 29/786 (2006.01); G02F 1/1343 (2006.01); G02F 1/1362 (2006.01); G02F 1/1368 (2006.01);
U.S. Cl.
CPC ...
H01L 27/124 (2013.01); H01L 21/77 (2013.01); H01L 27/12 (2013.01); H01L 27/127 (2013.01); H01L 27/1225 (2013.01); H01L 27/1288 (2013.01); H01L 29/45 (2013.01); H01L 29/4908 (2013.01); H01L 29/7869 (2013.01); H01L 29/78618 (2013.01); G02F 1/1368 (2013.01); G02F 1/13439 (2013.01); G02F 1/136286 (2013.01); G02F 2001/136295 (2013.01); G02F 2201/123 (2013.01);
Abstract

The embodiments of present disclosure disclose an array substrate, a method for manufacturing the array substrate, and a display device. The method includes forming a pixel electrode layer, a gate metal layer, and a source/drain metal layer on a base substrate, the pixel electrode layer including a first connection part pattern, the gate metal layer including a second connection part pattern, the source/drain metal layer including a third connection part pattern, wherein the first connection part pattern and the second connection part pattern overlap, and a portion of the first connection part pattern extending beyond the second connection part pattern is electrically connected with the third connection part pattern through a first via hole.

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