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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10186525 B1

PDFFull Text
Date of Patent:
Jan. 22, 2019

Filed:

Feb. 02, 2017

Circuit board, display device, and process for production of circuit board

Applicant:

Sharp Kabushiki Kaisha, Sakai, Osaka, JP;

Inventors:

Yuichi Saito, Sakai, JP;

Yohsuke Kanzaki, Sakai, JP;

Yudai Takanishi, Sakai, JP;

Tetsuya Okamoto, Sakai, JP;

Yoshiki Nakatani, Sakai, JP;

Yoshimasa Chikama, Sakai, JP;

Assignee:

SHARP KABUSHIKI KAISHA, Sakai, JP;

Attorney:

Keating & Bennett, LLP

Primary Examiner:

Allen Parker

Assistant Examiner:

Patricia Reddington

Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 27/12 (2006.01); H01L 21/3213 (2006.01); H01L 23/532 (2006.01); H01L 29/66 (2006.01); H01L 29/786 (2006.01); H01L 21/465 (2006.01); H01L 21/4763 (2006.01); H01L 29/24 (2006.01); H01L 29/45 (2006.01); H01L 21/02 (2006.01); G02F 1/1343 (2006.01); G02F 1/1362 (2006.01); G02F 1/1333 (2006.01); G02F 1/1368 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1225 (2013.01); H01L 21/02565 (2013.01); H01L 21/32134 (2013.01); H01L 21/465 (2013.01); H01L 21/47635 (2013.01); H01L 23/53233 (2013.01); H01L 23/53238 (2013.01); H01L 27/124 (2013.01); H01L 27/127 (2013.01); H01L 27/1222 (2013.01); H01L 27/1288 (2013.01); H01L 29/24 (2013.01); H01L 29/45 (2013.01); H01L 29/66969 (2013.01); H01L 29/7869 (2013.01); G02F 1/1368 (2013.01); G02F 1/13439 (2013.01); G02F 1/133345 (2013.01); G02F 1/134336 (2013.01); G02F 1/136286 (2013.01); G02F 2001/133302 (2013.01); G02F 2001/136231 (2013.01); G02F 2001/136236 (2013.01); G02F 2001/136295 (2013.01); H01L 21/02554 (2013.01); H01L 21/02631 (2013.01); H01L 21/44 (2013.01); H01L 2924/0002 (2013.01);
Abstract

The present invention provides a circuit board having excellent productivity, particularly a circuit board having excellent productivity with respect to a semiconductor layer and source layer forming step, a display device, and a process for producing a circuit board. The circuit board of the present invention is a circuit board including an oxide semiconductor layer and an electrode connected to the oxide semiconductor layer, wherein the electrode is formed by essentially laminating a layer made of a metal other than copper and a layer containing copper.

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