The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 22, 2019

Filed:

Aug. 28, 2017
Applicant:

Toshiba Memory Corporation, Tokyo, JP;

Inventors:

Kazushige Kawasaki, Yokohama Kanagawa, JP;

Mikihiko Ito, Ota Tokyo, JP;

Masaru Koyanagi, Ota Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 25/065 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5384 (2013.01); H01L 23/49811 (2013.01); H01L 25/0657 (2013.01); H01L 2225/06513 (2013.01);
Abstract

A semiconductor device includes a first chip having a through via, a second chip having a first terminal that is electrically connected to the through via, and a substrate having a second terminal disposed on a first surface thereof and electrically connected to the first terminal. When viewed along a straight line that intersects a center axis that is perpendicular to the first surface and intersects a center point of the substrate, the first terminal is disposed further towards the center axis than the second terminal and the through via is disposed further towards the center axis than the first terminal.


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