The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 22, 2019

Filed:

Feb. 07, 2017
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Hidenori Katsumura, Hyogo, JP;

Shinya Tokunaga, Kanagawa, JP;

Masaya Sumita, Hyogo, JP;

Hiroyoshi Yoshida, Kyoto, JP;

Yasuhiro Sugaya, Osaka, JP;

Kazuhide Uriu, Osaka, JP;

Osamu Shibata, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 25/00 (2006.01); B60R 11/04 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/64 (2006.01); H01L 23/00 (2006.01); H01L 49/02 (2006.01); H04N 5/225 (2006.01); H01L 23/48 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49589 (2013.01); B60R 11/04 (2013.01); H01L 23/3114 (2013.01); H01L 23/481 (2013.01); H01L 23/49541 (2013.01); H01L 23/49568 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/642 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 25/00 (2013.01); H01L 28/65 (2013.01); H04N 5/2252 (2013.01); B60R 2300/105 (2013.01); B60R 2300/301 (2013.01); H01L 23/367 (2013.01); H01L 23/49548 (2013.01); H01L 23/49861 (2013.01); H01L 24/49 (2013.01); H01L 2224/16265 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48265 (2013.01); H01L 2224/48463 (2013.01); H01L 2224/48464 (2013.01); H01L 2224/49113 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/49433 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83385 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1205 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19107 (2013.01); H04N 5/2257 (2013.01); H04N 5/2258 (2013.01);
Abstract

A semiconductor device includes a metal plate capacitor that includes a heat-resistant metal plate and a capacitor unit including a sintered dielectric formed on at least one surface of the heat-resistant metal plate, a semiconductor chip disposed on the metal plate capacitor, a connector configured to electrically connect the semiconductor chip and the metal plate capacitor, and a protector configured to protect the semiconductor chip, the metal plate capacitor, and the connector.


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