The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 22, 2019
Filed:
Mar. 31, 2016
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Stephan Pindl, Ergoldsbach, DE;
Daniel Lugauer, Altenthann, DE;
Dominic Maier, Pleystein, DE;
Alfons Dehe, Reutlingen, DE;
Assignee:
INFINEON TECHNOLOGIES AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 21/20 (2006.01); H01L 21/18 (2006.01); H01L 33/00 (2010.01); H01L 21/762 (2006.01); H01L 23/057 (2006.01); H01L 23/053 (2006.01); G01N 27/02 (2006.01); G01N 33/00 (2006.01); H01L 21/56 (2006.01); H01L 23/538 (2006.01); H05K 1/18 (2006.01); G01N 27/12 (2006.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
H01L 23/315 (2013.01); G01N 27/028 (2013.01); G01N 27/128 (2013.01); G01N 33/0036 (2013.01); H01L 21/185 (2013.01); H01L 21/187 (2013.01); H01L 21/2007 (2013.01); H01L 21/561 (2013.01); H01L 21/7624 (2013.01); H01L 23/053 (2013.01); H01L 23/057 (2013.01); H01L 23/296 (2013.01); H01L 23/31 (2013.01); H01L 23/3107 (2013.01); H01L 23/3128 (2013.01); H01L 23/5386 (2013.01); H01L 24/19 (2013.01); H01L 24/24 (2013.01); H01L 24/96 (2013.01); H01L 33/0079 (2013.01); H05K 1/181 (2013.01); H01L 21/568 (2013.01); H01L 23/291 (2013.01); H01L 23/295 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/73267 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/18162 (2013.01); H01L 2924/3025 (2013.01);
Abstract
According to an embodiment, a sensor package includes an electrically insulating substrate including a cavity in the electrically insulating substrate, an ambient sensor, an integrated circuit die embedded in the electrically insulating substrate, and a plurality of conductive interconnect structures coupling the ambient sensor to the integrated circuit die. The ambient sensor is supported by the electrically insulating substrate and arranged adjacent the cavity.