The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 22, 2019
Filed:
Sep. 03, 2013
Qualcomm Incorporated, San Diego, CA (US);
Hyunsuk Shin, San Diego, CA (US);
Jung Pill Kim, San Diego, CA (US);
Dexter Tamio Chun, San Diego, CA (US);
Jungwon Suh, San Diego, CA (US);
Qualcomm Incorporated, San Diego, CA (US);
Abstract
An enhanced multi chip package (eMCP) is provided including a unified memory controller. The UMC is configured to manage different types of memory, such as NAND flash memory and DRAM on the eMCP. The UMC provides storage memory management, DRAM management, DRAM accessibility for storage memory management, and storage memory accessibility for DRAM management. The UMC also facilitates direct data copying from DRAM to storage memory and vice versa. The direct copying may be initiated by the UMC without interaction from a host, or may be initiated by a host.