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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10185331 B1

PDFFull Text
Date of Patent:
Jan. 22, 2019

Filed:

Mar. 06, 2014

Modular computer and thermal management

Applicant:

Ice Computer, Inc., Saratoga, CA (US);

Inventors:

Shang-Che Cheng, Saratoga, CA (US);

Wei-Han Wu, New Taipei, TW;

Chia-Ming Lin, Taipei, TW;

Assignee:

ICE COMPUTER, INC., Saratoga, CA (US);

Attorneys:

Edward C. Kwok

VLP Law Group, LLP

Primary Examiner:

Thomas C Lee

Assistant Examiner:

Tri T Nguyen

Int. Cl.
CPC ...
G05D 7/06 (2006.01); G06F 1/20 (2006.01); G06F 1/32 (2006.01);
U.S. Cl.
CPC ...
G05D 7/0676 (2013.01); G06F 1/20 (2013.01); G06F 1/3293 (2013.01); G06F 2200/1635 (2013.01); Y02D 10/122 (2018.01);
Abstract

An enclosure design facilitates heat dissipation from a space-limited computer core device. An external computer platform is provided to connect the computer core device, the external computer platform including a fan that provides an air flow to the connected computer core device. The computer core device and the computing platform may be tightly connected by connectors located on their respective enclosure walls. Both the computer core device and the external computing platform are provided air inlets and outlets on their respective enclosures. When connected, an air inlet of the computer core device faces an air outlet of the external computing platform such that a single cooling air flow flows through the external computing platform and the computer core device. The external computing platform may include a built-in fan to blow air into or draw air from the matching air inlets and outlets.

Find Patent Forward Citations

Cheng, Shang-Che. (2019). Modular computer and thermal management (U.S. Patent No. 10185331). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10185331

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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