The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 22, 2019
Filed:
Jun. 08, 2015
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Jaeseung Chung, Suwon-si, KR;
Dongouk Kim, Pyeongtaek-si, KR;
Joonyong Park, Suwon-si, KR;
Jihyun Bae, Seoul, KR;
Bongsu Shin, Seoul, KR;
Jong G. Ok, Seoul, KR;
Ilsun Yoon, Seongnam-si, KR;
Sunghoon Lee, Seoul, KR;
Sukgyu Hahm, Gyeongju-si, KR;
SAMSUNG ELECTRONICS CO., LTD, Gyeonggi-Do, KR;
Abstract
A method of transferring a reverse pattern using an imprint process includes: preparing a master mold, where a first pattern is defined on a surface of the master mold; coating an imprint resin on the master mold to cover the first pattern; pressing the imprint resin toward the master mold using a stamp member; curing the imprint resin to form a second pattern between the master mold and the stamp member, where the second pattern has a reverse shape to a shape of the first pattern; detaching the stamp member from the master mold to separate the second pattern from the master mold; and transferring the second pattern onto a transfer substrate.