The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 22, 2019

Filed:

Jun. 23, 2016
Applicant:

Amazon Technologies, Inc., Seattle, WA (US);

Inventors:

Robert Arthur Sprague, Saratoga, CA (US);

Angeles Marcia Almanza-Workman, Sunnyvale, CA (US);

Wilfrido Loor Canizares, San Francisco, CA (US);

Siddharth Gupta, San Bruno, CA (US);

Vikram Srinivas, San Jose, CA (US);

Assignee:

Amazon Technologies, Inc., Seattle, WA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/167 (2006.01); H01L 27/12 (2006.01); G02F 1/1333 (2006.01); G02B 26/00 (2006.01);
U.S. Cl.
CPC ...
G02F 1/167 (2013.01); G02F 1/133305 (2013.01); H01L 27/1214 (2013.01);
Abstract

A thin border display for an electronic device may comprise an optical assembly that includes a support frame and an electrophoretic display (EPD) structure attached to the support frame in a manner that allows for the display of the electronic device to exhibit a 'thin border' or 'borderless' look at a periphery of the electronic device. A portion of the EPD structure may at least partly curve around a curved portion of the support frame, the curved portion of the support frame being near the periphery of the support frame. In some embodiments, the EPD structure includes a transparent protective substrate disposed on a rear surface of a flexible backplane substrate within the flat outer region where a driver chip is disposed on a front surface of the flexible backplane substrate. The transparent protective substrate protects the driver chip attachment from being damaged during manufacture.


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