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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10183866 B1

PDFFull Text
Date of Patent:
Jan. 22, 2019

Filed:

Sep. 17, 2015

Composition for forming conductive pattern and resin structure having conductive pattern

Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Han Nah Jeong, Daejeon, KR;

Chee-Sung Park, Daejeon, KR;

Ha Na Lee, Daejeon, KR;

Cheol-Hee Park, Daejeon, KR;

Jae Hyun Kim, Daejeon, KR;

Shin Hee Jun, Daejeon, KR;

Eun Kyu Seong, Daejeon, KR;

Su Jeong Lee, Daejeon, KR;

Assignee:

LG Chem, Ltd., Seoul, KR;

Attorney:

Dentons US LLP

Primary Examiner:

Jessica Whiteley

Int. Cl.
CPC ...
C08F 4/00 (2006.01); C08F 2/00 (2006.01); C08G 61/04 (2006.01); C01B 15/16 (2006.01); H01B 5/14 (2006.01); H01B 1/02 (2006.01); H05K 3/18 (2006.01); C01G 3/00 (2006.01); C01G 55/00 (2006.01); C08G 75/0209 (2016.01); C08L 55/02 (2006.01); C09D 7/61 (2018.01); C08K 3/32 (2006.01); C09D 5/24 (2006.01); C09D 169/00 (2006.01); H05K 1/09 (2006.01); C08G 65/38 (2006.01);
U.S. Cl.
CPC ...
C01B 15/16 (2013.01); C01G 3/006 (2013.01); C01G 55/004 (2013.01); C08G 75/0209 (2013.01); C08K 3/32 (2013.01); C08L 55/02 (2013.01); C09D 5/24 (2013.01); C09D 7/61 (2018.01); C09D 169/00 (2013.01); H01B 1/026 (2013.01); H01B 5/14 (2013.01); H05K 1/09 (2013.01); H05K 3/185 (2013.01); C01P 2002/30 (2013.01); C01P 2004/38 (2013.01); C08G 65/38 (2013.01); C08K 2003/326 (2013.01); C08K 2003/328 (2013.01); C08L 2205/24 (2013.01); H05K 2203/072 (2013.01); H05K 2203/107 (2013.01);
Abstract

The present invention relates to a composition for forming a conductive pattern and a resin structure having a conductive pattern, wherein the composition makes it possible to form a fine conductive pattern on various polymer resin products or resin layers through a simple process, and can more effectively meet needs of the art, such as displaying various colors. The composition for forming a conductive pattern, comprises: a polymer resin; and a non-conductive metal compound having a predetermined chemical structure, and may be a composition for forming a conductive pattern through electromagnetic irradiation, by which a metal nucleus is formed from the non-conductive metal compound.

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