The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 22, 2019
Filed:
Jul. 28, 2017
Applicant:
Lbp Manufacturing Llc, Cicero, IL (US);
Inventors:
Thomas Z. Fu, Naperville, IL (US);
Matthew R. Cook, Oak Brook, IL (US);
Earle R. Ellis, Bolingbrook, IL (US);
Assignee:
LBP Manufacturing LLC, Cicero, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B31B 50/00 (2017.01); B31B 70/62 (2017.01); B65D 81/38 (2006.01); B29C 44/12 (2006.01); B29C 44/44 (2006.01); B29C 35/08 (2006.01); B31B 50/04 (2017.01); B31B 50/28 (2017.01); B31B 50/88 (2017.01); B31B 50/81 (2017.01); B31B 70/64 (2017.01); B31B 70/74 (2017.01); B29K 105/16 (2006.01); B05B 13/02 (2006.01); B31B 105/00 (2017.01); B31B 50/74 (2017.01);
U.S. Cl.
CPC ...
B31B 70/62 (2017.08); B29C 35/0805 (2013.01); B29C 44/1228 (2013.01); B29C 44/445 (2013.01); B31B 50/00 (2017.08); B31B 50/04 (2017.08); B31B 50/28 (2017.08); B31B 50/81 (2017.08); B31B 50/88 (2017.08); B31B 70/64 (2017.08); B31B 70/74 (2017.08); B31B 70/79 (2017.08); B65D 81/3823 (2013.01); B65D 81/3869 (2013.01); B65D 81/3874 (2013.01); B05B 13/0242 (2013.01); B29C 2035/0855 (2013.01); B29K 2105/165 (2013.01); B31B 50/745 (2017.08); B31B 50/756 (2017.08); B31B 2105/00 (2017.08); B31B 2105/0022 (2017.08);
Abstract
Insulated packaging is provided including an inner substrate and an outer substrate attached to the inner substrate to form an air gap therebetween. An expandable material including expandable microspheres is provided with the expandable material disposed between the inner substrate and the outer substrate. An adhesive material different than the expandable material is disposed between the inner substrate and the outer substrate to attach the inner substrate to the outer substrate. A method for forming the insulated packaging is also provided.