The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 22, 2019

Filed:

Oct. 16, 2014
Applicant:

Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;

Inventors:

Lamine Benaissa, Massy, FR;

Jean-Sebastien Moulet, Chambery, FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 61/00 (2006.01); H01L 41/113 (2006.01); B82B 3/00 (2006.01); B32B 3/28 (2006.01); B32B 3/30 (2006.01); C03B 23/02 (2006.01); G01L 1/16 (2006.01); B28B 17/00 (2006.01); H01L 21/302 (2006.01); H01L 21/3105 (2006.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
B29C 61/00 (2013.01); B28B 17/0009 (2013.01); B32B 3/28 (2013.01); B32B 3/30 (2013.01); B82B 3/0033 (2013.01); C03B 23/02 (2013.01); G01L 1/16 (2013.01); H01L 41/1132 (2013.01); B29K 2105/256 (2013.01); B32B 2250/02 (2013.01); B32B 2307/51 (2013.01); H01L 21/302 (2013.01); H01L 21/3105 (2013.01);
Abstract

A method forming an elastic undulated layer locally lying on a substrate from a structure including a strained elastic layer on a foundation in a solid state present at a surface of a rigid substrate, the method including: melting a foundation for a duration of at least 50 ns, the foundation thickness being at least 20 nm and lower than a predetermined thickness corresponding to a theoretical peak-to-peak amplitude of wrinkles, the melting generating a simultaneous deformation, by forming wrinkles, of the elastic layer and the foundation and accompanied by localized adherent contact between the elastic layer and the rigid substrate in zones separating regions of the foundation; solidifying the foundation to bring it back to the solid state; removing the foundation brought back to the solid state to suspend a layer above the substrate outside the zones of localized adherent contact, the suspended layer being undulated in accordance with the wrinkles.


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