The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 15, 2019

Filed:

May. 02, 2014
Applicant:

The Boeing Company, Huntington Beach, CA (US);

Inventors:

Charles E. Kusuda, Mukilteo, WA (US);

Jeffrey W. Glasnovich, Bothell, WA (US);

Erik L. Godo, Redmond, WA (US);

Roy D. Nye, Snohomish, WA (US);

Namsoo P. Kim, Bellevue, WA (US);

Assignee:

THE BOEING COMPANY, Chicago, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20536 (2013.01); H05K 7/205 (2013.01); H05K 7/207 (2013.01); H05K 7/20509 (2013.01);
Abstract

In one aspect, conduction cooled modules are described herein. In some implementations, a conduction cooled module comprises first and second external support structures arranged in facing opposition to one another, forming a component envelope therebetween. In some implementations, the modules are configured to contact at least one cold plate and to retain at least one printed wiring board in the component envelope in between the first external support structure and the second external support structure.


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