The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 15, 2019

Filed:

Nov. 09, 2016
Applicant:

The University of Memphis Research Foundation, Memphis, TN (US);

Inventor:

Bashir I. Morshed, Germantown, TN (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01); H05K 1/03 (2006.01); H05K 3/12 (2006.01); H05K 1/09 (2006.01); H05K 1/02 (2006.01); H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H05K 1/028 (2013.01); H05K 1/0353 (2013.01); H05K 1/097 (2013.01); H05K 1/113 (2013.01); H05K 3/125 (2013.01); H05K 3/303 (2013.01); H05K 3/4007 (2013.01); H05K 3/4053 (2013.01); H05K 3/4069 (2013.01); H05K 3/4664 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10143 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10174 (2013.01);
Abstract

A multilayer printed circuit as well as printed passive and active electronic components using additive printing technology is provided. The fabrication process includes a substrate and a first conductive layer that is printed with conductive ink on the substrate. An insulation layer that has uniform thickness is printed on the first conductive layer and the substrate, less via cavities, test point cavities, and a surface mount component contact point and mounting cavities. The insulation layer is replaceable with resistive layer or semi-conductive layer to fabricate electronic components. The vias are printed with conductive ink inside of the via cavities. Additionally, a second conductive layer is printed on the vias and over the insulation layer. The insulation, resistive, or semi-conducting layer, the vias, and the conductive layers are repeatedly printed in sequence to thus form the multilayer printed circuit.


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