The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 15, 2019

Filed:

Jan. 09, 2018
Applicant:

Infinera Corporation, Sunnyvale, CA (US);

Inventors:

Peter W. Evans, Tracy, CA (US);

Mingzhi Lu, Fremont, CA (US);

Fred A. Kish, Jr., Palo Alto, CA (US);

Vikrant Lal, Sunnyvale, CA (US);

Scott Corzine, Sunnyvale, CA (US);

John W. Osenbach, Kutztown, PA (US);

Jin Yan, Paoli, PA (US);

Assignee:

Infinera Corporation, Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/00 (2006.01); H01S 5/06 (2006.01); H01S 5/024 (2006.01); H01S 5/026 (2006.01); H01S 5/042 (2006.01); H01S 5/10 (2006.01); H01S 5/22 (2006.01); H01S 5/30 (2006.01); G02B 6/28 (2006.01); H04B 10/50 (2013.01); H04B 10/61 (2013.01); G02F 1/225 (2006.01); H04B 10/2507 (2013.01); H04B 10/40 (2013.01); H04B 10/67 (2013.01); H01S 5/0625 (2006.01); H01S 5/12 (2006.01); H01S 5/20 (2006.01); H01S 5/32 (2006.01);
U.S. Cl.
CPC ...
H01S 5/0612 (2013.01); G02B 6/2813 (2013.01); G02F 1/2255 (2013.01); G02F 1/2257 (2013.01); H01S 5/0261 (2013.01); H01S 5/02453 (2013.01); H01S 5/02461 (2013.01); H01S 5/0425 (2013.01); H01S 5/06256 (2013.01); H01S 5/1003 (2013.01); H01S 5/1017 (2013.01); H01S 5/22 (2013.01); H01S 5/3013 (2013.01); H04B 10/2507 (2013.01); H04B 10/40 (2013.01); H04B 10/503 (2013.01); H04B 10/616 (2013.01); H04B 10/67 (2013.01); H01S 5/1014 (2013.01); H01S 5/1215 (2013.01); H01S 5/2081 (2013.01); H01S 5/3214 (2013.01); H01S 2301/176 (2013.01);
Abstract

Methods, systems, and apparatus, including a laser including a layer having first and second regions, the first region including a void; a mirror section provided on the layer, the mirror section including a waveguide core, at least part of the waveguide core is provided over at least a portion of the void; a first grating provided on the waveguide core; a first cladding layer provided between the layer and the waveguide core and supported by the second region of the layer; a second cladding layer provided on the waveguide core; and a heat source configured to change a temperature of at least one of the waveguide core and the grating, where an optical mode propagating in the waveguide core of the mirror section does not incur substantial loss due to interaction with portions of the mirror section above and below the waveguide core.


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