The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 15, 2019

Filed:

Oct. 04, 2016
Applicants:

Autonetworks Technologies, Ltd., Yokkaichi-shi, Mie, JP;

Sumitomo Wiring Systems, Ltd., Yokkaichi-shi, Mie, JP;

Sumitomo Electric Industries, Ltd., Osaka-shi, Osaka, JP;

Inventor:

Takanobu Shimada, Yokkaichi, JP;

Assignees:

AUTONETWORKS TECHNOLOGIES, LTD., Yokkaichi-shi, Mie, JP;

SUMITOMO WIRING SYSTEMS, LTD., Yokkaichi-shi, Mie, JP;

SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka-shi, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 43/048 (2006.01); H01B 7/00 (2006.01); H01B 13/00 (2006.01); H01R 4/18 (2006.01); H02G 1/14 (2006.01);
U.S. Cl.
CPC ...
H01R 43/048 (2013.01); H01B 7/00 (2013.01); H01B 13/00 (2013.01); H01R 4/18 (2013.01); H01R 4/185 (2013.01); H02G 1/14 (2013.01); H01B 7/0009 (2013.01);
Abstract

A production method for a terminal-equipped electrical wire in which a terminal including a bottom plate portion and a pair of wire barrels extending sideward from the bottom plate portion is crimped to a core wire exposed at an end of an electrical wire, includes: a step of placing the core wire on the bottom plate portion; and a step of allowing the wire barrels to surround the core wire and be crimped to the core wire using a crimp tool, wherein the crimp tool includes a first tool having a placement face on which the bottom plate portion and the core wire are placed, and a second tool having a curved face for holding and curving the wire barrels between the curved face and the placement face, and a surface roughness Ra2 of the curved face is larger than a surface roughness Ra1 of the placement face (Ra2>Ra1).


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