The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 15, 2019

Filed:

Sep. 29, 2015
Applicant:

Stmicroelectronics SA, Montrouge, FR;

Inventors:

Jean-Francois Carpentier, Grenoble, FR;

Sébastien Pruvost, Froges, FR;

Patrice Garcia, Crolles, FR;

Pierre Busson, Grenoble, FR;

Pierre Dautriche, Montbonnot, FR;

Assignee:

STMicroelectronics SA, Montrouge, FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 21/00 (2006.01); H01Q 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01Q 19/00 (2006.01); H01Q 19/10 (2006.01); H01Q 19/185 (2006.01); H01L 23/31 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
H01Q 21/0087 (2013.01); H01L 23/3114 (2013.01); H01L 23/49816 (2013.01); H01L 23/49838 (2013.01); H01L 23/66 (2013.01); H01L 24/13 (2013.01); H01Q 19/005 (2013.01); H01Q 19/10 (2013.01); H01Q 19/185 (2013.01); H01Q 21/0025 (2013.01); H01Q 21/0093 (2013.01); H01Q 23/00 (2013.01); H01L 23/3128 (2013.01); H01L 23/552 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/1319 (2013.01); H01L 2224/13582 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/014 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15311 (2013.01);
Abstract

A millimeter wave transceiver including a plate forming an interposer having its upper surface supporting an interconnection network and having its lower surface intended to be assembled on a printed circuit board by bumps; an integrated circuit chip assembled on the upper surface of the interposer; antennas made of tracks formed on the upper surface of the interposer; and reflectors on the upper surface of the printed circuit board in front of each of the antennas, the effective distance between each antenna and the reflector plate being on the order of one quarter of the wavelength, taking into account the dielectric constants of the interposed materials.


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