The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 15, 2019

Filed:

Sep. 29, 2017
Applicant:

Fuji Electric Co., Ltd., Kanagawa, JP;

Inventors:

Hideaki Matsuyama, Hino, JP;

Shinya Takashima, Hachioji, JP;

Katsunori Ueno, Matsumoto, JP;

Takuro Inamoto, Kawasaki, JP;

Masaharu Edo, Tokorozawa, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/00 (2006.01); H01L 29/10 (2006.01); H01L 21/02 (2006.01); H01L 21/265 (2006.01); H01L 29/20 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/08 (2006.01);
U.S. Cl.
CPC ...
H01L 29/1095 (2013.01); H01L 21/0254 (2013.01); H01L 21/26546 (2013.01); H01L 29/2003 (2013.01); H01L 29/66446 (2013.01); H01L 29/66734 (2013.01); H01L 29/7813 (2013.01); H01L 29/0856 (2013.01); H01L 29/0873 (2013.01);
Abstract

In a case where a semiconductor layer is epitaxially grown on a step shape formed due to CBL (current blocking layer) formation, the crystallinity of the semiconductor layer lowers. Also, a GaN layer that is epitaxially regrown on the CBL is not formed continuously by epitaxial growth, and therefore the crystallinity of the GaN layer lowers. A vertical semiconductor device manufacturing method is provided that comprises: a step of epitaxially growing a gallium nitride-based n-type semiconductor layer on a gallium nitride-based semiconductor substrate; a step of epitaxially growing a gallium nitride-based p-type semiconductor layer on the n-type semiconductor layer; and a step of ion-implanting p-type impurities to form a p-type embedded region selectively in a predetermined depth range across the boundary between the n-type semiconductor layer and the p-type semiconductor layer.


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