The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 15, 2019

Filed:

Mar. 17, 2015
Applicant:

Sony Corporation, Tokyo, JP;

Inventors:

Keiji Tatani, Kanagawa, JP;

Tomoharu Ogita, Kanagawa, JP;

Takashi Nagano, Kanagawa, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H04N 5/232 (2006.01); H04N 5/369 (2011.01); H04N 5/374 (2011.01); H04N 5/378 (2011.01); H04N 9/04 (2006.01); H04N 5/3745 (2011.01);
U.S. Cl.
CPC ...
H01L 27/14605 (2013.01); H01L 27/1464 (2013.01); H01L 27/14621 (2013.01); H01L 27/14623 (2013.01); H01L 27/14627 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H01L 27/14641 (2013.01); H01L 27/14645 (2013.01); H01L 27/14665 (2013.01); H04N 5/23212 (2013.01); H04N 5/23251 (2013.01); H04N 5/3696 (2013.01); H04N 5/374 (2013.01); H04N 5/378 (2013.01); H04N 5/3745 (2013.01); H04N 9/045 (2013.01);
Abstract

The present disclosure relates to a solid-state image sensor, an electronic apparatus and an imaging method by which specific processing other than normal processing can be sped up with reduced power consumption. The solid-state image sensor includes a pixel outputting a pixel signal used to construct an image and a logic circuit driving the pixel, and is configured of a stacked structure in which a first semiconductor substrate including a plurality of the pixels and a second semiconductor substrate including the logic circuit are joined together. In addition, among the plurality of pixels, a specific pixel is connected to the logic circuit independently of a normal pixel, the specific pixel being the pixel that outputs the pixel signal used in the specific processing other than imaging processing in which the image is imaged. The present technology can be applied to a stacked solid-state image sensor, for example.


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