The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 15, 2019
Filed:
Nov. 13, 2015
Sony Corporation, Tokyo, JP;
Eiichiro Dobashi, Kumamoto, JP;
Takahiro Wakabayashi, Kumamoto, JP;
SONY CORPORATION, Tokyo, JP;
Abstract
The present technology relates to a camera module capable of reducing the number of steps in the manufacturing process and reducing a black spot failure, a method for manufacturing the camera module, an imaging apparatus, and an electronic instrument. A frame and the rigid flexible substrate are adhered to each other by adhesive formed of thermosetting resin applied on an abutment surface excluding a portion of a range including a bonding section with the FPC drawer unit, thereby forming a vent hole in a site where adhesive has not been applied. At this time, the air of the space between the frame and the rigid flexible substrate is expanded by the heat and discharged from the vent hole. Subsequently, after adhesion is performed with thermosetting resin, reinforcement resin that reinforces the bonding section between the rigid flexible substrate and the FPC drawer unit or that reinforces the bonding section between the rigid flexible substrate and the frame is applied so as to close a portion of the range on which the adhesive has not been applied. This enables omitting the process of closing the vent hole. The present technology can be applied to a camera module.