The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 15, 2019

Filed:

Mar. 15, 2017
Applicant:

Google Inc., Mountain View, CA (US);

Inventors:

William Riis Hamburgen, Palo Alto, CA (US);

James Cooper, San Francisco, CA (US);

Assignee:

GOOGLE LLC, Mountain View, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 1/20 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H05K 7/18 (2006.01); H01L 23/34 (2006.01); H05K 7/20 (2006.01); G06F 1/16 (2006.01); H01L 23/36 (2006.01); H01L 23/46 (2006.01); H05K 7/00 (2006.01); H01L 23/42 (2006.01);
U.S. Cl.
CPC ...
G06F 1/20 (2013.01); G06F 1/16 (2013.01); H01L 23/34 (2013.01); H01L 23/345 (2013.01); H01L 23/36 (2013.01); H01L 23/3675 (2013.01); H01L 23/373 (2013.01); H01L 23/3733 (2013.01); H01L 23/42 (2013.01); H01L 23/46 (2013.01); H05K 7/00 (2013.01); H05K 7/18 (2013.01); H05K 7/20 (2013.01);
Abstract

A computing device includes a case enclosure, a heat-generating electrical component, and a thermal insulator. The thermal insulator has a first surface adhesively bonded to the surface of the case enclosure and has a second surface adhesively bonded to the surface of the heat-generating component. The thermal insulator includes a layer of thermally-insulating material between the first and second surfaces, and the thermally-insulating material has a thermal conductivity less than 35 mW/m-K.


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