The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 15, 2019

Filed:

Mar. 12, 2015
Applicants:

Schlumberger Technology Corporation, Sugar Land, TX (US);

University of Maryland, College Park, College Park, MD (US);

Inventors:

Chandradip Pravinbhai Patel, Stafford, TX (US);

Mark Alex Kostinovsky, Houston, TX (US);

Francis Dupouy, Stonehouse, GB;

Glen Dell Schilling, Richmond, TX (US);

Gilles Iafrate, Clamart, FR;

F. Patrick McCluskey, Ellicott City, MD (US);

Assignees:

SCHLUMBERGER TECHNOLOGY CORPORATION, Sugar Land, TX (US);

UNIVERSITY OF MARYLAND, COLLEGE PARK, College Park, MD (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); E21B 17/02 (2006.01); B23K 1/20 (2006.01); B23K 35/26 (2006.01); B23K 35/02 (2006.01);
U.S. Cl.
CPC ...
E21B 17/028 (2013.01); B23K 1/0008 (2013.01); B23K 1/20 (2013.01); B23K 35/0244 (2013.01); B23K 35/262 (2013.01);
Abstract

The disclosure describes soldering a first component () to a second component () for use in a downhole circuit, device and/or tool. The first component () includes an electrically conductive contact region () finished with a metallic finish layer (). The soldering includes disposing a layer of manganese () adjacent to the metallic finish layer (), and applying solder () to the layer of manganese (). The solder () used in the soldering of the two components is a mixture of copper, silver and tin.


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